HiConnects
Heterogeneous Integration for Connectivity and Sustainability
Classificazione:
internazionali
Programma:
Altri programmi dell'Unione Europea
Call / Bando:
KDT JU - HORIZON-KDT-JU-2021-1-IA
Ruolo Unict:
Partner
Durata del progetto in mesi:
45
Data inizio:
Domenica, 1 Gennaio 2023
Data fine:
Mercoledì, 30 Settembre 2026
Costo totale:
€ 120.000.000,00
Quota Unict:
€ 71.328.150,00
Coordinatore:
NXP Germany - STMicroelectronics s.r.l.
Responsabile/i per Unict:
Prof. Costa - Prof. Battiato
Dipartimenti e strutture coinvolte:
Dipartimento di Matematica e Informatica
Altri partner:
AIXTRON SE
APPLIED MATERIALS ISRAEL
ASM AMICRA Microtechnologies GmbH
AT&S Austria Technologie & Systemtechnik AG
AT-ITALY
AVL TURKEY
Barkhausen Institut gGmbH
BESI AUSTRIA GMBH
Besi Netherlands
Brillianetor
BRUKER TECHNOLOGIES LTD
Centria University of Applied sciences
Skillreal
CORETIGO LTD
CSEM
DeepXScan
EV Group E. THALLNER GMBH
EVATEC
Exaddon
EXCILLUM AB
FEI ELECTRON OPTICS BV
Ferdinand-Braun-Institut gGmbH
FORD OTOMOTIV SANAYI ANONIM SIRKETI
Fraunhofer
HORSA S.p.A.
Huber Diffraktionstechnik
HYPERION Technologies
ICOS VISION SYSTEMS NV
INNOLUME
INTERUNIVERSITAIR MICRO ELECTRONICA CENTRUM
Orbotech LTD
NANOMOTION LTD
NEARFIELD INSTRUMENTS B.V
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST
NATUURWETENSCHAPPELIJK ONDERZOEK TNO
NOVA LTD
NVIDIA-IL
NXP Semiconductors France S.A.S.
NXP Semiconductors Netherlands
BV
Phononics
Politecnico di Torino
Politecnico di Milano
Qtechnology A/S
Sanlab Simulasyon AR. GE. Sanayi Ticaret LTD. STI. (SNLB)
Savox Communications Ltd
SEMI EUROPE GMBH
SEMILAB FELVEZETO FIZIKAI LABORATORIUM
RESZVENTARSASAG
Siemens EDA (SEDA)
SmartUniversal
Softability Ltd
SOLMATES BV
STMicroelectronics s.r.l
TECHNISCHE UNIVERSITEIT EINDHOVEN
Teramount
3DiS Technologies
TUBITAK
TURKCELL
ULAK
UNIVERSITATEA POLITEHNICA DIN BUCURESTI
University of Catania
NOVALIX
KLA-Tencor Corporation Israel
PHIX
FORD GERMANY
Abstract
HiCONNECTS is a consortium of 64 partners from 15 countries, develops the next generation of electronic components and systems heterogeneous integration core technology solutions for energy-efficient, high-performance wireless/wired cloud and edge computing and automotive radar in support of the next radio frequency and IT technology evolution.
The high-level objective of HiCONNECTS is to support major societal and industrial challenges by developing heterogenous integration (HI) core technology solutions for energy-efficient and highperformance wireless/wired cloud and edge computing as well as automotive radar to solve two of the main state-of- the art roadblocks: the transmission of Internet of Things (IoT) data over the IT network and sensing of objects to enable Highly Automated Driving (HAD). Today, high latency, limited bandwidth, and high energy consumption per bit of information of current wireless/cloud platforms cannot satisfy the IoT applications that require real-time response. Furthermore, a lack of resolution, classification, segmentation, localization, and mapping of current radars is not sufficient for Level 4 and 5 HAD.
The second and directly linked objective is to use these HI components to develop solutions in societal and economical important areas, with major focus on RF infrastructure (networking cards and switches) for the advancement of vertical sectors such as connected technologies (5G/6G and radar) and IT data growth vehicles, smart cities, and connected industry.